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10 of BGA Rework Stencils. Ball Count 352. Grid Size & Ball Pattern 26 x 26, P4-Row. These flexible solder paste stencils are laser cut from high quality, anti-static polymer film with a residue-free adhesive backing.
Because they are self-sticking, no tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when the paste is applied. Flextac Stencils are easy to use and leave no residue on the board surface.
Please contact us with any questions or comments you might have.
PQ: 1 | PWIP: 0.02 | REF: 6