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ST-304-2BG16X19-8 EMULATION TECHNOLOGY Repair Kit kit
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Part Number:
ST-304-2BG16X19-8
Manufacturer:EMULATION TECHNOLOGY
Item ID: 2098000594EMULATION TECHNOLOGY ST-304-2BG16X19-8 spec
- package: bulk
- item per pack: 10
Item in stock
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EMULATION TECHNOLOGY ST-304-2BG16X19-8 pricing
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Description
10 of BGA Rework Stencils. Ball Count 304. Grid Size & Ball Pattern 16 x 19, Full Array. These flexible solder paste stencils are laser cut from high quality, anti-static polymer film with a residue-free adhesive backing.
Because they are self-sticking, no tape or fixturing is needed. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when the paste is applied. Flextac Stencils are easy to use and leave no residue on the board surface.
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