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Snap-on BGA Heatsink. Easily Installed. No special board modifications. Snaps on and self aligns. Maintains constant pressure on chip with tension mounted clip. Saves Labor.
Eliminates complex assemblies. No epoxy. No spring loaded pushpins that lose tension. No screw devices that loosen. No special tools needed.
Please contact us with any questions or comments you might have.
PQ: 2 | PWIP: 0.01 | REF: 30