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H-2303-03-9017-05-A EMULATION TECHNOLOGY heat sink

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Part Number:

H-2303-03-9017-05-A

Manufacturer:

EMULATION TECHNOLOGY

Item ID: 2099000545

EMULATION TECHNOLOGY H-2303-03-9017-05-A spec

  • package: bulk
  • item per pack: 1
  • Width: 0.82 in, Height: 0.47 in, Length: 0.82 in

Item in stock
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Quantity:

(number in the box shows required min quantity)

EMULATION TECHNOLOGY H-2303-03-9017-05-A pricing

Qty
2
5
5+
Unit Price
7.00
6.75
Price
14.00
33.75

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Description

Snap-on BGA Heatsink. Easily Installed. No special board modifications. Snaps on and self aligns. Maintains constant pressure on chip with tension mounted clip. Saves Labor.

Eliminates complex assemblies. No epoxy. No spring loaded pushpins that lose tension. No screw devices that loosen. No special tools needed.

spec sheet icon EMULATION TECHNOLOGY H-2303-03-9017-05-A data sheet

PQ: 2 | PWIP: 0.01 | REF: 30

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