Discount Electronic Components
Need assistance? Give us a call. (631) 234-3857
H-2503-01-9031-05-A EMULATION TECHNOLOGY heat sink
click picture to enlarge
Part Number:
H-2503-01-9031-05-A
Manufacturer:EMULATION TECHNOLOGY
Item ID: 2099000546EMULATION TECHNOLOGY H-2503-01-9031-05-A spec
- package: bulk
- item per pack: 1
- Width: 0.97 in, Height: 0.28 in, Length: 0.97 in
Item in stock
can ship right now
(number in the box shows required min quantity)
EMULATION TECHNOLOGY H-2503-01-9031-05-A pricing
Did you see a better price somewhere else?
Request Price Match!
Description
Snap-on BGA Heatsink. Easily Installed. No special board modifications. Snaps on and self aligns. Maintains constant pressure on chip with tension mounted clip. Saves Labor.
Eliminates complex assemblies. No epoxy. No spring loaded pushpins that lose tension. No screw devices that loosen. No special tools needed.
EMULATION TECHNOLOGY H-2503-01-9031-05-A data sheetQuestions and Answers
- Minimum Order Quantity is 4. Why?
- What is your Privacy Policy?
- When will my order ship?
- Will I get a tracking number and a copy of an invoice?
Please contact us with any questions or comments you might have.
PQ: 4 | PWIP: 0.01 | REF: 40
We accept all major credit cards and PayPal.
